I was afraid this would happen and scraped a bunch of excess solder paste off the footprint with a scalpel to try and clean it up.
Apparently not enough.
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I was afraid this would happen and scraped a bunch of excess solder paste off the footprint with a scalpel to try and clean it up.
Apparently not enough.
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Andrew Zonenberg
In response to this postI swear *every* time i think i can get away with a suboptimal paste print, it bites me.
These LGA modules are not very forgiving of smeared/excessive paste volume at all. And yet somehow they have worse print quality than the 0.65mm BGA which printed fine.
I did not see THAT coming. It's not a solder defect.
The removed module measured 18 ohms to ground, a new replacement 24K.
So the module itself is bad. The heat seal on the bag had failed so maybe it popcorned during reflow or something?
I'm gonna bake the replacement before I put it on (which I had done for this one but maybe not long enough since it was thick?)
by Andrew Zonenberg ;
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